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PE4309
Product Specification
Figure 3. Pin Configuration (Top View)
Table 3. Operating Ranges
Parameter
V DD Power Supply Voltage
Min
3.0
Typ
3.3
Max
5.5
Units
V
N/C
VDD
1
2
18
17
N/C
N/C
I DD Power Supply Current
P IN Input power (50 ? )
100
250
+24
μ A
dBm
N/C
RF1
3
4
Exposed
Ground
Paddle
16
15
N/C
RF2
Table 4. Absolute Maximum Ratings
N/C
ACG
5
6
14
13
N/C
ACG
Symbol
V DD
Parameter/Conditions
Power supply voltage
Min
-0.3
Max
6.0
Units
V
V I
T ST
T OP
Voltage on any DC input
Storage temperature range
Operating temperature
range
-0.3
-65
-40
6.0
150
85
V
°C
°C
Table 2. Pin Descriptions
P IN
Input power (50 ? )
30
dBm
Pin No.
1
Pin Name
N/C 7
No Connect
Description
V ESD
ESD voltage (Human Body
Model)
2000
V
2
V DD
Power supply pin
3
4
5
6
7
8
N/C 5
RF1
N/C 5
ACG 6
ACG 6
ACG 6
No Connect
RF port
No Connect
AC Ground connection
AC Ground connection
AC Ground connection
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS? device, observe the
same precautions that you would use with other ESD-
sensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
9
ACG
6
AC Ground connection
rate specified in Table 4.
10
11
12
13
14
15
16
17
ACG 6
ACG 6
N/C 7
ACG 6
N/C 5
RF2
N/C 5
N/C 5
AC Ground connection
AC Ground connection
No Connect
AC Ground connection
No Connect
RF port
No Connect
No Connect
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS?
devices are immune to latch-up.
Switching Frequency
The PE4309 has a maximum 25 kHz switching rate.
Table 5. Control Voltage
18
19
20
21
N/C 5
C16
C8
C4
No Connect
Attenuation control bit, 16 dB
Attenuation control bit, 8 dB
Attenuation control bit, 4 dB
State
Low
High
Bias Condition
0 to +1.0 Vdc at 2 μ A (typ)
+2.0 to +5 Vdc at 10 μ A (typ)
22
23
24
Paddle
C2
C1
C0.5
GND
Attenuation control bit, 2 dB
Attenuation control bit, 1 dB
Attenuation control bit, 0.5 dB
Ground for proper operation
The standard 3V or 5V CMOS control logic is
independent of supply voltage.
Table 6. Truth Table
Notes: 5. For improved RF performance these No Connect pins can
be connected to RF ground.
C16
1
C8
1
C4
1
C2
1
C1
1
C0.5 Attenuation State
1 Reference Loss (IL)
6. Pins can either be grounded directly or through coupling
capacitors
7. Pin can either be grounded or No Connect
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the package
must be grounded for proper device operation.
1
1
1
1
1
0
0
1
1
1
1
0
1
0
1
1
1
0
1
1
0
1
1
0
1
1
1
0
1
0
1
1
1
1
0
0
1
1
1
1
1
0
0.5 dB
1 dB
2 dB
4 dB
8 dB
16 dB
31.5 dB
?2007 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0218-07
│ UltraCMOS? RFIC Solutions
Page 2 of 9
Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
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